Summary
Yuan Yao is a process engineer at Intel with 11 years of experience applying materials chemistry and microfabrication expertise to advanced photolithography and device fabrication. With a PhD background and research at UIUC on silicon microcells, luminescent solar concentrators, and nanocone light-trapping structures, he blends deep academic insight with production-scale process engineering. At Intel since 2017 he focuses on pushing lithography process windows while leveraging diffusion/passivation and transfer-printing strategies developed in prior research. Comfortable translating novel device architectures into manufacturable flows, he brings a rare combination of chemistry, semiconductor physics, and hands-on fabrication know-how to high-volume manufacturing. Based in Urbana, Illinois, he pairs rigorous experimental design with practical yield-driven problem solving.
10 years of coding experience
8 years of employment as a software developer
Bachelor's Degree, Chemistry and Economics (Double Major), Bachelor's Degree, Chemistry and Economics (Double Major) at Peking University
University of Illinois Urbana-Champaign